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The substrate support mechanism uses for through hole processing of the printed circuit board by laser

IP.com Disclosure Number: IPCOM000011950D
Original Publication Date: 2003-Mar-27
Included in the Prior Art Database: 2003-Mar-27

Publishing Venue

IBM

Abstract

Disclosed is a supporting mechanism for a work panel at through hole forming process by laser drilling. When laser energy reaches the supporting panel on stage of laser drill machine after forming the through hole, the supporting material is decomposed by the laser energy and adhered to the work panel surface and through hole barrel as contamination. This invention disclosure provides the mechanism to prevent the work panel from contamination.