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How to form laser holes efficiently by changing a beam shot sequence (Scatter shot method)

IP.com Disclosure Number: IPCOM000011951D
Original Publication Date: 2003-Mar-27
Included in the Prior Art Database: 2003-Mar-27

Publishing Venue

IBM

Abstract

Disclosed is a method for forming vias and through holes in printed circuit board by laser drilling. As through hole pitch becomes small and laser speed increases, the laser heat energy for a through hole tends to spread and reaches the position of adjacent through hole so that the adjacent through holes are to be drilled under unstable heat condition and have a large distribution of geometry in them. This invention discloser provides a method to control the heat condition by optimizing the laser drilling sequence.