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Polymer-Coated Metal Fillers to Improve the Thermal Conductivity of Polymer Materials Used in Semiconductor Packaging

IP.com Disclosure Number: IPCOM000012018D
Publication Date: 2003-Apr-02

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a semiconductor packaging method that uses polymer materials that contain polymer-coated metal fillers. Benefits include thermal conductivity without the electrical functionality.