Browse Prior Art Database

Server Chassis / Rack Thermal / Mechanical Solution Disclosure Number: IPCOM000012060D
Original Publication Date: 2003-Apr-04
Included in the Prior Art Database: 2003-Apr-04
Document File: 3 page(s) / 149K

Publishing Venue



Disclosed is a Server / Rack Mechanical Chassis and Thermal Cooling solution designed to minimize cost and time to production by enabling the chassis structural element to serve as both the structural and thermal cooling means for the electronic package. A similar approach can be applied to server racks.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 70% of the total text.

Page 1 of 3

Server Chassis / Rack Thermal / Mechanical Solution

    The disclosed invention utilizes elongated profiles, in this instance, extruded, aluminum profiles, for the purpose of providing structural integrity and processor electronic component or peripheral cooling capability.

    The structural advantage of "beam-like" sections has been exploited for generations, utilizing maximum resistance to bending while minimizing the amount of material needed to provide the same benefit. The cross-section depicted below (see Figure 1, End View) embodies such a structural element. The section is extruded to provide a beam of a given length, in this case it serves as the structural sides of the enclosure. The geometry of such a cross-section can additionally allow for peripheral attachments, utilizing the channels it provides for the means of fastening, securing and adjusting. For example, a top cover can slide in one of the channel recesses. Or, rack mounting can be integrated into the side recesses of the channel. Additionally, such channels can provide recesses for routing wires and cables, taking them out of harm's way. As an added feature, the extrusion profile may be designed as a building block that can be added together to create larger profiles. For example, the height of the profile can be 1U or approximately 1.75" tall and two of said units can be splined together to create a 2U unit.


[This page contains 54 pictures or other non-text objects]

Page 2 of 3

  The thermal advant...