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Server Chassis / Rack Thermal / Mechanical Solution

IP.com Disclosure Number: IPCOM000012060D
Original Publication Date: 2003-Apr-04
Included in the Prior Art Database: 2003-Apr-04

Publishing Venue

IBM

Abstract

Disclosed is a Server / Rack Mechanical Chassis and Thermal Cooling solution designed to minimize cost and time to production by enabling the chassis structural element to serve as both the structural and thermal cooling means for the electronic package. A similar approach can be applied to server racks.