Browse Prior Art Database

LOW COST POWER QFN PACKAGING CONCEPT (LC PQFN)

IP.com Disclosure Number: IPCOM000012104D
Original Publication Date: 2003-Apr-08
Included in the Prior Art Database: 2003-Apr-08

Publishing Venue

Motorola

Related People

Authors:
Lan Chu TAN Cheng Choi YONG Ruzaini IBRAHIM Azhar ARIPIN

Abstract

Existing Power QFN (PQFN) packages are assembled using heavy 5, 10, 15, 20 mils Al wires. Such heavy wires requires a heavy wedge bonding process, which has low throughput and high cost. In this paper we present a PQFN in which the heavy Al wires have been replaced with two 4 or 5 mils diameter Cu wires. Together with a thermally conductive mold compound, the new PQFN performs as well thermally as existing packages. Through thermal performance simulation, we have determined that the Theta JA’s for the new package are comparable to that of the existing package. The new packaging recipe has a much lower cost because only a single wirebonding platform is required and throughput is increased.