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Disclosed is a method that replaces the silica in the build-up resins of substrates with hollow glass microspheres. Benefits include improving CTE while lowering the dielectric constant.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
70% of the total text.
Modification of Thermosetting Dielectric
Build-Up Materials for Imprinting PC Boards by Use of Small Hollow Glass
Disclosed is a method that replaces the silica in the
build-up resins of substrates with hollow glass microspheres. Benefits include
improving CTE while lowering the dielectric constant.
Currently, to lower the CTE of the epoxy build-up layers,
raw material providers add silica filers.�
Silica’s low CTE (~2 ppm) and small particle size make it an almost idea
filler. � The key weakness, however, is
that it has a higher dielectric constant (~4 for silica) than the epoxy
resin.� Keeping the dielectric constant
low is critical to meeting electrical performance targets in high performance
In the disclosed method, the particles not only fit in a ~50
micron thick dielectric layer, but do not interfere when imprinting features
within 5 microns of the underlying core material. Imprinting micro-via features
to 5 microns of the surface is important because of the need to clear the vias.
If a chemical or plasma etch is used, the amount of material to be removed must
be small relative to the 15 – 25 micron deep lines and traces. Otherwise, the
lines and traces are severely eroded. If a large particle size microsphere is
used, all the lines and traces will be over eroded, a show-stopper issue for
the imprinting process.
The disclosed method describes a range of particle sizes
(below ~5 microns) that allow hollow glass...