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Modification of Thermosetting Dielectric Build-Up Materials for Imprinting PC Boards by Use of Small Hollow Glass Microspheres

IP.com Disclosure Number: IPCOM000012115D
Publication Date: 2003-Apr-09

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that replaces the silica in the build-up resins of substrates with hollow glass microspheres. Benefits include improving CTE while lowering the dielectric constant.