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Method for metal channels for fluid transfer to dissipate heat in a multilayer PWB

IP.com Disclosure Number: IPCOM000012116D
Publication Date: 2003-Apr-09

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for metal channels for fluid transfer to dissipate heat in a multilayer printed wire board (PWB). Benefits include improved thermal performance, improved design flexibility, and improved ease of manufacturing.