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Method for a chamfer ledge handling media to accommodate BGA interconnect circuit packages that are fully populated

IP.com Disclosure Number: IPCOM000012197D
Publication Date: 2003-Apr-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a chamfer ledge handling media to accommodate ball grid array (BGA) interconnect circuit packages that are fully populated. Benefits include improved functionality and improved performance.