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Method for a drop-in heatsink/heat slug with a well mold for MMAP LDI technology

IP.com Disclosure Number: IPCOM000012199D
Publication Date: 2003-Apr-16

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a drop-in heatsink/heat slug with a well mold for molded matrix array package (MMAP) low-density interconnect (LDI) technology. Benefits include improved thermal performance.