Browse Prior Art Database

Method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations

IP.com Disclosure Number: IPCOM000012345D
Publication Date: 2003-Apr-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for strengthening the component-to-board solder joint through the increase of component package ball-grid pad surface areas and annulations. Benefits include improved reliability.