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Method for a heatsink with a recessed contact surface for improved material/HS integration and performance

IP.com Disclosure Number: IPCOM000012347D
Publication Date: 2003-Apr-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a heatsink (HS) with a recessed contact surface for improved material/HS integration and performance. Benefits include improved thermal performance and improved ease of manufacturing.