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Method for a drop-on-demand unit-level ink mark for flexible tape FSCSP and molded SCSP and VF-BGA packages

IP.com Disclosure Number: IPCOM000012350D
Publication Date: 2003-Apr-30

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a drop-on-demand unit-level ink mark for flexible tape folded stacked chip scale packages (FSCSP) and molded stacked chip scale packages (SCSP) and very fine-ball grid array (VF-BGA) packages. Benefits include improved yield.