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Method for a spacer-less stack-die package design by dual-side wire bonding

IP.com Disclosure Number: IPCOM000012431D
Publication Date: 2003-May-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a spacerless stack-die package design using dual-side wire bonding. Benefits include improved functionality, improved support for future technologies, and improved cost effectiveness.