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Thermal Management Designs for Natural Convection Cooled Low Profile Adaptor

IP.com Disclosure Number: IPCOM000012543D
Publication Date: 2003-May-14

Publishing Venue

The IP.com Prior Art Database

Abstract

Abstract: This paper describes the experience gained from the mechanical and thermal management design of a slim (12mm thickness) AC/DC adaptor used in notebook computer or portable devices. In general, the mechanical and thermal design of adapter products is extremely challenging due to increased power density requirements. The following describes the key thermal management challenges, introduces a novel method of partitioning the housing structure, and shares innovative construction concepts. The method of partitioning provides a cooler housing enclosure that can extend the lifetime of electronic components, in particular, electrolytic capacitors.