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Z-axis mounted Inertial Sensor or Integrated Circuit

IP.com Disclosure Number: IPCOM000012686D
Publication Date: 2003-May-20

Publishing Venue

The IP.com Prior Art Database

Abstract

To vertically mount an integrated circuit or micro-machined (micromachined or MEMS) device, etc., arrange the wirebond layout of the die so that all the wirebond connections are made at one end of the die. Alternately, arrange the wirebond layout of the die so that all the wirebond connections are made on multiple ends or edges of the die that are adjacent to the package pins (solder leads).