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Disclosed is a method for a bridged mounting pad with reduced equivalent series inductance (ESL) for a multi-terminal decoupling capacitor. Benefits include improved performance.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
77% of the total text.
Method for a bridged mounting pad with reduced ESL for a
multi-terminal decoupling capacitor
Disclosed is a method for a bridged mounting pad with reduced
equivalent series inductance (ESL) for a multi-terminal decoupling capacitor. Benefits include improved performance.
� � � � � � � � � � The
conventional multi-terminal decoupling capacitor has isolated and bridged
terminals (see Figure 1). Alternating power and ground terminals reduce the
overall ESL values because of a short inductance loop between adjacent
terminals. One typical power plane connects four power terminals while the
other four terminals are connected through isolated capacitor (cap) pads, which
increase the overall ESL value. The bridged terminal pad is required to reduce
the ESL and enhance the decoupling solutions.
� � � � � The disclosed method is a mounting-pad
design with reduced ESL for an 8-terminal (8‑T) interdigitated chip (IDC)
decoupling capacitor (decap). All the terminals on the pad are bridged (common) terminals (see Figure
2).� As a result, the cap ESL is reduced
and decoupling solutions are enhanced.
� � � � � Simulation results for a metal core unit cell clearly reveal
the advantage of using the bridged cap pad (see Figure 3). Total loop
inductance decreases by 18% when hot spots of the package are assumed to be at
the edge of the unit cell. If the hot spots get farther from decap, the
improvement would be greater.
� � � � � No additional manufacturing process or c...