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Disclosed is a method for inhomogeneous dielectric poles to minimize electromagnetic interference (EMI) for a metal core package. Benefits include improved performance and improved ease of implementation.
English (United States)
This text was extracted from a Microsoft Word document.
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This is the abbreviated version, containing approximately
57% of the total text.
Method for inhomogeneous dielectric poles to minimize EMI
for a metal core package
Disclosed is a method for inhomogeneous dielectric poles to
minimize electromagnetic interference (EMI) for a metal core package. Benefits include improved performance and improved ease of
� � � � � When a microprocessor
has a high clock frequency and requires a high power supply, the EMI radiation
is an issue. It must be investigated and optimized for each design stage that
includes a package. Conventional methods for package level EMI reduction
include: shielding (grounding), absorption (adding electromagnetic absorbing
materials), and optimalization. Shielding and absorption are high cost.
Optimalization is almost pushed to its limit. Therefore, alternative approaches
must meet the EMI requirement and achieve high efficiency and
� � � � � Conventionally,
electromagnetic (EM) energy originates from the slots between the power and
ground planes (see Figure 1).
� � � � � The disclosed method
is inhomogeneous dielectric poles to minimize EMI radiation from package level
due to high electromagnetic reflections. Dielectric poles are buried in
build-up layers to prevent the generation of electromagnetic interference.
� � � � � In each build-up
layer, laser drill holes are created around the substrate and filled with other
higher permitivity dielectric material. The minimization can be controlled by
the following factors: