Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for sealed edges of bonded wafers for 3D wafer-stacking applications

IP.com Disclosure Number: IPCOM000012779D
Publication Date: 2003-May-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for sealed edges of bonded wafers for 3D wafer-stacking applications. Benefits include improved reliability.