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Method for a BGA solder preform for the rework and assembly of BGA packages with surface mount components

IP.com Disclosure Number: IPCOM000012785D
Publication Date: 2003-May-28

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ball grid array (BGA) solder preform for the rework and assembly of BGA packages with surface-mount components. Benefits include improved yield and improved process simplification.