Browse Prior Art Database

A New Method Connecting Heavy Heat Sink to PCB and Packages

IP.com Disclosure Number: IPCOM000012803D
Original Publication Date: 2003-May-28
Included in the Prior Art Database: 2003-May-28

Publishing Venue

Motorola

Related People

Authors:
Yuan Yuan Bennett Joiner Tony Montes De Oca

Abstract

This article describes a novel method connecting heat sink to printed circuit board (PCB or PWB) and package. It has significant advantage over other methods when the heat sink is heavy and bulky. Different from the traditional method, the heat sink is firmly supported by a frame connected to the PCB. Additional control also provided to ensure adequate thermal contact between heat sink and the package. This method avoids excessive force on the package and prevents the heat sink from loosing contact with the package during shock and vibration.