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MODULATED METAL MICROSTRUCTURE

IP.com Disclosure Number: IPCOM000012830D
Original Publication Date: 2003-May-30
Included in the Prior Art Database: 2003-May-30

Publishing Venue

IBM

Abstract

A modulated metal microstructure for improved wet etch taper control or for the formation of an interdigitated electrode for a capacitor is disclosed. Layers of a pure refractory metal, such as Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, or alloys thereof are alternated with thin layers of the same refractory metal or alloy which contain a second element which reduces the wet etch rate.