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Multilevel air gap interconnect structure with photosensitive dielectric

IP.com Disclosure Number: IPCOM000012831D
Original Publication Date: 2003-May-30
Included in the Prior Art Database: 2003-May-30

Publishing Venue

IBM

Abstract

It is shown how the use of photosensitive dielectric materials can simplify the fabrication of certain air-gap-containg interconnect structures.