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Defect-localized barrier repair process for copper interconnect structures

IP.com Disclosure Number: IPCOM000012832D
Original Publication Date: 2003-May-30
Included in the Prior Art Database: 2003-May-30

Publishing Venue

IBM

Abstract

Disclosed is an electroless plating method to repair barrier or liner defects in interconnect structures with copper wiring. The method is defect-localized in that it adds new barrier material only to places where Cu is exposed.