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Selective Wet Etching of Microcontact-Printed Au and Ag Substrates Using Fe3+ and Thiourea Disclosure Number: IPCOM000012913D
Original Publication Date: 2003-Jun-10
Included in the Prior Art Database: 2003-Jun-10

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Disclosed is an etch bath for fabricating thin Au and Ag patterns by using microcontact printing (5CP) and selective wet etching. Specifically, the etch system is an acidic aqueous solution of Fe3+ and thiourea.