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Selective Wet Etching of Microcontact-Printed Au and Ag Substrates Using Fe3+ and Thiourea

IP.com Disclosure Number: IPCOM000012913D
Original Publication Date: 2003-Jun-10
Included in the Prior Art Database: 2003-Jun-10

Publishing Venue

IBM

Abstract

Disclosed is an etch bath for fabricating thin Au and Ag patterns by using microcontact printing (5CP) and selective wet etching. Specifically, the etch system is an acidic aqueous solution of Fe3+ and thiourea.