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Attachment to an IC Package Using Focused Light or Laser to Instantly Solder the Integral Heat Spreader to the Package

IP.com Disclosure Number: IPCOM000012945D
Publication Date: 2003-Jun-11

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of attaching an integrated heat spreader (IHS) to an IC package, using highly focused light beams or lasers as a reflow heat source. Benefits include a reduction in process costs, equipment, and steps.