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REDUCING HEAT CONDUCTION DURING THERMAL TACK PROCESS

IP.com Disclosure Number: IPCOM000012965D
Original Publication Date: 2000-Feb-01
Included in the Prior Art Database: 2003-Jun-11

Publishing Venue

IBM

Abstract

The current head attach process for ILS suspension is using thermal adhesive which is required to use some source of energy, such as a laser, to cure adhesive. However, in order to have a high tack process, there are two approaches: using high energy source or increasing the process time However, increasing the process time is not a good solution due to the slowing down of the throughput. Therefore, using the high energy source is the only solution. However, using high energy from a laser source can cause local burn on the suspension. Therefore, reducing heat conduction during thermal tack process will help to tack the adhesive faster and avoid the local burn on the suspension. Referring to Figure 1, the current flexure design has no heat conductivity path. The heat (from a laser beam) can not localize at the particular region. However, the heat can be localized in the new proposal flexure design (shown in Figure 2). With this design, the heat will not be lost due to the conduction phenomenal. In fact, the heat conductivity path is reduced by the etching-holes around laser beam. All holes are made through etching process with diameter of 0.1mm.