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A new PCB pattern to improve the heat sink characteristic

IP.com Disclosure Number: IPCOM000013011D
Original Publication Date: 2001-Feb-01
Included in the Prior Art Database: 2003-Jun-12

Publishing Venue

IBM

Abstract

Disclosed is a new print circuit board (PCB) pattern that is invented. This pattern can improve the thermal characteristics of the mounted IC modules. Some surface-mounted IC modules have a heat-sink plate, which is on the back side of the module and soldered with a pad of PCB, to improve the thermal characteristics. The pad has relatively large area and large amount of solder. This brings heterogeneous solder wet and heat sink characteristics. In addition, it is hard to set the IC module to precise position due to the surface tension of the solder. If the via (through hole) is placed in the pad area, the heat sink characteristics is strongly improved because surface area is extended. On the other hand, the solder easily slip off the pad and the characteristic is lowered if the via exists.