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Plating Cluster With Metrology Modules

IP.com Disclosure Number: IPCOM000013293D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue

IBM

Related People

Authors:
Robert Browne Bigal Leung Joseph Fatula Bob Hitzfeld Andrew Chiu

Abstract

This publication describes an electroplating cluster tool that includes metrology devices within the cluster. Following plating, measurements are normally made to asses the results of the plating process. By incorporating these measurements in the cluster tool process, advantages are gained in floor space, cycle time, wafer handling and manufacturing labor. The improved proximity of measurement to plating process would also permit rapid use of measurement data to adjust the process. Examples of measurement devices are thickness profilers, X-ray composition analysis, permeance and coercivity testers. 1