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Retest Of BGA Devices Disclosure Number: IPCOM000013295D
Original Publication Date: 2001-Jan-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue



Ball Grid Array (BGA) devices can cost up to $500 each. During the assembly and test process these devices may have to be removed from a circuit board. The process of removing the devices renders them unusable. Disclosed is a specially designed "pogo pin type" socket affixed to a 'known good' circuit board so that suspect devices can be retested. Good devices can be reballed and reused. At present when a BGA device is removed from a card there is no method of checking if the device is good or bad without having the device reballed and resoldered to acard. If the device is bad them it must be removed and replaced. The advantage of this disclosure is that both removed devices and reballed devices can be tested using the specially designed "pogo pin" type socket. This allows instant feedback to the debug engineer as to whether his debug is correct and also saves the expense of reballing and refitting a device that may be defective. It is also possible to tell instantly if a device is faulty and claim against the supplier of the device. At present most card manufacturers scrap BGA devices that have been removed from cards due to the expense of having these modules reballed and retested. 1