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Socket Attach Rotational Apparatus

IP.com Disclosure Number: IPCOM000013297D
Original Publication Date: 2000-Oct-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue

IBM

Abstract

Disclosed is a tool which allows for improved placement of socket type interposers. This tool allows the operator to assemble the socket module and heatsink system by presenting both sides of the printed circuit board in a controlled manner. As shown in the figure, this tool allows the operator to assemble both sides of the circuit card from the correct vantage point. Prior to development of this tool, the operator had to assemble the circuit card upside down, causing increased numbers of assembly related defects and greater operator fatigue. 1 2