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Impinging Heat Sink with flow-through passages for Cooling Multi-Component Modules

IP.com Disclosure Number: IPCOM000013376D
Original Publication Date: 2002-May-21
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue

IBM

Abstract

The relentless quest for higher performance and lower cost digital electronics is resulting in the formation of multi-component modules: silicon chips and single chip (predominantly memory) modules mounted onto a single electronics package/substrate. Figure 1. shows a top view of such a module. The components on the package most always differ in component height and power dissipation. Components heights can vary by as much as 1.5 mm (0.060 inches). The silicon chip (i.e. ASIC) is typically a processor function dissipating heat on the order of ten or more watts; the single chip modules are typically memory modules dissipating heat between a few tenths of a watt up to two watts. SDRAM Space for Decaps Z 0.98 mm for 100 nf 22.22 mm X 10.16 mm