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Foot print design for EP Package Disclosure Number: IPCOM000013423D
Original Publication Date: 2002-Feb-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue



1. ABSTRACT Disclosed is the card physical design method to make it easy to confirm solderbility between heat sink and raw card. 2. INVENTION This invention is foot print design on raw card for heat sink E xposed Paddle package (Refer FIG-1). As shown in FIG-2, monitor area is specially designed which is isolated from the heat sink area on foot print. One or more monitor area are prepared on raw card, then Monitoring conductivity of point1 and 2 (refer FIG-3) makes it is possible to check solder attachment ration without visual inspection. Exposed paddle package