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Moisture condensation free refrigerated chip modules Disclosure Number: IPCOM000013608D
Original Publication Date: 2001-Oct-27
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue



Moisture condenation free refrigerated semiconductor microprocessor chip modules Idea of disclosure Moisture condensation on refrigerated microprocessor chip modules is difficult to avoid when the chip module temperature goes below the dew point of the air in the module. Moisture condensation can cause severe corrosion and degradation of the chip metallurgy. This invention proposes means of avoiding moisture condensation on the chips cooled well below the dew point temperature. The invention avoids moisture condensation by surrounding the incoming cold refrigerant tube with desiccant such that the desiccant is cooled prior to the cooling of the chip hardware. It is known that cooled desiccant absorbs more moisture than desiccant at room temperature. Cooling the desiccant therefore makes it a better desiccant. Another design feature proposed here is to simultaneously cool the air surrounding the chip as the chip is cooled. Normally cooling air in an enclosure raises its %RH. But when the enclosure has desiccant in it, the %RH does not rise. Lowering temperature of air without letting its %RH rise causes the air to have less moisture in it. Dew point is directly related to the amount of moisture in the air. Thus cooling the air in the presence of desiccant, lowers its dew point: and if the dew point is lowered below the chip hardware temperature, moisture condensation is avoided. The chip module enclosure air can be cooled by including a refrigerant-to-air heat exhanger and/or by blowing air on the cold plate.