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Holding method for electronic devices by top cover or panel Disclosure Number: IPCOM000013701D
Original Publication Date: 2001-Mar-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue



Disclosed is a packaging method to hold electronic devices such as ; Printed circuit cards/boards, electronic devices and semiconductors by top cover. This packaging method can prevent defects caused by electrostatic discharge and physical damages by