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Plating Cluster Tool With Integrated Asher Disclosure Number: IPCOM000013722D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-18

Publishing Venue


Related People

Robert Browne Bigal Leung Bob Hitzfeld Joseph Fatula Andrew Chiu


This publication describes an electroplating cluster tool configuration that has a surface preparation device (such as an asher or reactive ion etch system) attached and integrated into the cluster operation. Prior to plating, the cluster robot will move the wafer to the attached device. Following the surface prep process, the robot will transfer the wafer to a plating module within the cluster tool. The addition of an asher-type device improves cycle time, reduces floor space and handling, and establishes uniform and repeatable timing in this in-line process for plating. The asher is shown attached to the cluster it is also conceivable that the asher could be a module within the cluster. 1