Automatic Split/Merge function
Original Publication Date: 2002-Jun-01
Included in the Prior Art Database: 2003-Jun-18
Summary: Manufacturing execution system (MES) controls the semiconductor manufacturing plant. MES keeps the route information that include the list of process flow, process and metrology tools, recipe and other specifications. The manufacturing process fabricate the integrated circuit on the wafers. The wafers are stored in a cassette or other kinds of containers while in the manufacturing line. MES usually controls a cassette as a lot. Sometimes engineers want to process some of the wafers in a lot with different process conditions for an experiment. This invention allows the engineers to define the process split and merge for these experimental wafers. Background: Most of the manufacturing tools in the manufacturing line are designed to process a cassetteful of wafers at a time. Engineering experiment requires to process some of the wafers in the cassette with different process parameter at the certain process. You need to split the wafers into several lots before the experimental process, then process them with the engineering matrix, and merge them again into a lot with current MES. Invention Description: You can define the split point of the route for the experimental wafers. You can also define the process condition for each lots. Then, the merge point in the route can be defined too. Detailed information: The main route for the product defines process #100, #200, 300 through 900 as shown in the diagram. An engineer wants to make a experiment matrix at the process #300 and 400, and at the process #800. You can define the auto split point at operation #300, with merge point at operation #500. Also you can define the split point at operation #800 with merge point #900. Wafers #4,5,and 6 will be processed with the condition defined in the sub-route RSBT01 at the operation #310 and #410. Wafers #7,8 and 9 will be processed with the condition defined in the sub-route RSBT02 while the others, wafer #1,2 and 3 will be processed normally. At process #800, wafers #2,5 and 8 will be processed with the condition defined as RSB-51, wafer #3,6 and 9 will be processed with conditions of RSB053. This way, the engineer can run the experiment matrix with the MES.