Browse Prior Art Database

Virtual Mirror and Virtual Mirror Cross Over on Package Decoupling Disclosure Number: IPCOM000013942D
Original Publication Date: 2000-Mar-01
Included in the Prior Art Database: 2003-Jun-19

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Disclosed is a device that allows components such as processors, caches, host bridges, memory etc. to be close together. This closeness will allow the busses connecting these components to operate at higher frequencies or with more timing margins and the systems they are in to become smaller in size. This device is especially useful for the “Virtual Mirror Package” referred to as VMP and the “Virtual Mirror Cross Over Package” referred to as VMCOP which have patent applications pending. Typical computer systems have integrated circuit components separated from each other by distance with decoupling capacitors at each location. One restraint in bringing the components closer together is the need to decouple each component. Currently this decoupling is placed around the perimeter of the components or underneath the components. The preferred embodiment discussed for this invention is VMCOP and will be discussed first. Figure 1 Virtual Mirror Cross Over Package (VMCOP)