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Chip attachment method with adjustable chip placement angle

IP.com Disclosure Number: IPCOM000014132D
Original Publication Date: 2001-Jan-01
Included in the Prior Art Database: 2003-Jun-19

Publishing Venue

IBM

Abstract

This describes new method to directly attach chip on rigid substrate such as glasses to be used for liquid crystal display products by using anistropic conductive tape. Invented process flow is described as follows. The advantage of this invented process is that even pressure from heater head is given to the anistropic conductive tape. process flow referring to fig. 1) (1) Glass substrate thickness at both ends where chip is to be placed, are measured by such as laser measuring tool prior to chip placement .