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Plating Cluster With Composition Measurement

IP.com Disclosure Number: IPCOM000014206D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-19

Publishing Venue

IBM

Related People

Authors:
Robert Browne Joseph Fatula Bob Hitzfeld Andrew Chiu

Abstract

This publication describes the inclusion of a composition analysis device in an electroplating cluster tool. Following plating, it is desireable to determine the composition (ratio of metals in the alloy) of the plated films. With a composition metrology unit in the cluster, the robot will transfer the wafer to that module following plating. Composition data will then be collected and used to disposition the wafer and adjust the process (if needed) for optimum results. 1