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FLOW BATCH for MES

IP.com Disclosure Number: IPCOM000014240D
Original Publication Date: 2002-Jun-01
Included in the Prior Art Database: 2003-Jun-19

Publishing Venue

IBM

Abstract

Disclosed is a function for Manufacturing Execution System (MES) for semiconductor manufacturing plants. Background and objective: Semiconductor manufacturing process is repeating to apply a film on the wafer, to fabricate circuit on it, then to apply another film on it. Most of the process are starting with cleaning the wafers. In the case of 200 mm wafer process, the cleaning process is usually 2 cassettes at a time by a wet bench. The cleaning process is typically followed by a film deposition process. Most popular manufacturing equipment for this kind of process loads 4 cassettes. The rest of the process are usually with one cassette at a time process. MES is designed to maximize the utilization of each process tools. If MES dispatch cassettes to the cleaning wet bench to maximize the utilization of the wet bench. The cleaned wafers in the processed cassettes will be in the queue for the tube furnace. A batch of the tube furnace usually takes hours. However the wet bench cleaning is much shorter. To avoid forming a natural oxide film, the queue time after wet bench to tube furnace must be in a specified duration.