Skew Adjustment Method with Considering Thermal Influence
Original Publication Date: 2000-Dec-01
Included in the Prior Art Database: 2003-Jun-19
Disclosed is a method for an adjustment of skew of signals on a circuit board with considering thermal influence. The method provides high reliability for thermal variation in customer environments. It becomes important to adjust skew of clock signals, control signals, and data signals precisely in these days. These critical signals should be patterned on a print circuit board very carefully with considering skews among them. However propagation of these signals inside components will be affected by temperature and temperatures around each components are not same, so it might not work as expected in some case even though patterning on the board are done very carefully. The disclosed method will solve this kind of problem. Driver modules with skew adjustment function, that is on the market, are placed between components for critical signals and thermal sensor modules are placed around related components. Then the skew is adjusted dynamically with monitoring temperatures. The figure below is an example. The firmware is monitoring temperatures around component 1 and 2 by using the thermal sensors. Then the firmware select the best skew value and set it into the driver module according to the measured temperatures. These skew adjustment is done dynamically.