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Process for Producing Plated Microvias with a Barrier Layer

IP.com Disclosure Number: IPCOM000014258D
Original Publication Date: 2001-Apr-20
Included in the Prior Art Database: 2003-Jun-19

Publishing Venue

IBM

Abstract

Disclosed is an enhanced process for creating microvias for high density interconnect applications, by using thin copper foil as a surface barrier. By utilizing the copper foil as your base layer, one can provide a barrier on the surface to prevent hydrogen, from electroless copper plating, from diffusing into the parts and producing adhesive and cohesive blistering, along with other benefits. Process steps include: 1) Thin copper foil is laminated onto the dielectric material that the microvias are to be formed in. 2) Selective etch the foil to reveal the underlying registration features.