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Plating Cluster Tool With Resist Strip Disclosure Number: IPCOM000014553D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-19

Publishing Venue


Related People

Robert Browne Bob Hitzfeld Joseph Fatula Andrew Chiu


This publication describes an electro plating cluster tool configuration that has additional module(s) to remove resist from the wafers following plating. At the completion of the plating process, the robot transfers the wafer to the resist strip module. Within the strip module, the wafer is processed with the appropriate solvent to remove the resist, rinsed and dried. The robot then moves the completed (plated and stripped) wafer to the output cassette in the load/unload module. This configuration eliminates wafer handling and queue time that normally occurs between plating and resist removal. 1