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Improved Thin Film Disk Media Using Optimum Surface Polish Pad Life For Reducing Disk Drive Thermal Asperity (TA & TA Adds)

IP.com Disclosure Number: IPCOM000014641D
Original Publication Date: 2000-Dec-01
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Abstract

Improved Thin Film Disk Media Using Optimum Surface Polish Pad Life For Reducing Disk Drive Thermal Asperity (TA TA Adds) Disclosed is a method for improving disk drive media performance by controlling Thermal Asperity's caused by (NiP) Nickel Phosphorus Weldments that occur during substrate texturing process. Setting limitations to texture pad life significantly reduces pad loading and improves disk drive performance and reliability. Weldments are caused by a NiP particles being cold welded back onto the disk surface, (See Ref. #1) . Weldments are inherent in the texturing process. Texturing galls the surface of the disk and removes some NiP particles. Some of the particles stick to/in the pad. Others exit to drain after the pad rinse and brush cycle. Build-up of these particles in the pads increase the frequency of weldments over time. More build-up in the pad pores (See Ref. #2) means less volume to hold NiP particles. Assuming particle generation is constant then over time the particles seen at the pad/disk interface must be increasing as storage decreases in the pores, (See Ref. #3). Some particles scratch the surface while others cold weld to the surface (weldment).