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A New structure of Heatpipes attached to LSIs

IP.com Disclosure Number: IPCOM000014664D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Related People

Authors:
Toshi Kataoka Kenji Fukuzato Kenji Hamahata

Abstract

This article describes a new structure of heatpipes attached to LSIs. The new structure (Figure 1) improves thermal conductivity, thus lowers the temperature of LSI in comparison with a conventional structure (Figure 2). The conventional structure attaches a heatpipe to a LSI with a plate and thermal conductive grease or rubber. There is open space between the heatpipe and the plate, in case the heatpipe is cylindrical. The new structure improves thermal conductivity by filling up the space with the grease pressed out through small holes on the plate. The following table shows that the new structure keeps the temperature of the LSI lower by more than six degrees Centigrade than the conventional one. Temperature of LSI Conventional Structure 59.6 degrees C New Structure 53.0 degrees C Delta -6.6 degrees C