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Probe Card with Flexible Wiring Mechanism

IP.com Disclosure Number: IPCOM000014669D
Original Publication Date: 2000-Aug-01
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Abstract

Disclosed is a wafer test probe card with flexible wiring structure. Conventional probe card is constructed by printed circuit board and probe needles, and there are two ways to deliver VDD and/or GND to the needles. One is treating VDD and/or GND as signals. This allows us to use same probe card for any parts numbers whose physical pad layout is equal. However, this causes higher VDD/GND impedance and less VDD/GND stability. Another is having VDD and GND planes in the printed circuit board. This gives us the best VDD/GND stability but need to built probe card for the every specific part numbers. The disclosed probe card with flexible wiring structure consists of stacked two printed circuit boards and probe needles as shown in Fig.1. Two printed circuit boards shall be fastened by screws etc. as shown in Fig. 2.