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LCD MODULE STRUCTURE Disclosure Number: IPCOM000014679D
Original Publication Date: 2000-Sep-01
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue



Disclosed is a Chip On Glass (COG) LCD module structure which minimizes the LCD module peripheral packaging area and thickness with lower cost by re-layout of the driver IC pad and related FPC. 1. Conventional COG module design Figure-1 shows the conventional COG module structure. The driver IC is mounted on the glass and FPC is attached outside of the driver IC, which requires packaging area "B" for total. In this structure, the driver IC is designed as figure-2 (Input bumps are arranged on outside.) and the input signal electrodes are placed as figure-3 and connected to outside FPC. 1 2. Disclosed COG module design Figure-4 and figure-5 show the disclosed COG module structure and driver IC design respectively. The differences from the conventional structure are both layout of the FPC and the driver IC pad layout fitting with FPC layout. FPC is placed between the driver ICs, which results in smaller packaging area than conventional structure. The input bumps of the driver IC are arranged on both side of the IC (figure-4) and the input signal patterns are horizontally placed. The packaging dimension (same dimension as "B" in figure-1) can be reduced to minimal.