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Thermoconductive device in HDD for reliability enhancement Disclosure Number: IPCOM000014746D
Original Publication Date: 2001-Mar-01
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue



Disclosed is a method to conduct the heat from a IC uniformly by inserting a thermal conductor material between a Disk Enclosure (DE) and the top of the IC package on a logic card of a Hard Disk Drive (HDD). Recently a data processor IC's power consumption increases as the data rate of the HDD goes up. As the result, the heat from the IC goes up, too. And slowing thermal variation and reducing the IC junction temperature is required to keep the reliability of the IC. Inserting the thermal conductor between the DE and the top of the IC package is able to make another thermal conduction path toward the DE in addition to toward the air and the board.