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ECO plasma CVD

IP.com Disclosure Number: IPCOM000015169D
Original Publication Date: 2002-Apr-11
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue



Disclosed is a new PECVD Plasma Enhanced Chemical Vapor Deposition tool which has an intelligent function to suppress PFC Perfluorinated Compound emissions and results in the preservation of global environment, because PFC is one of the sources which cause global warming like CO2 is. PECVD tool is usually using a large amount of PFC to remove the film such as SiO2 deposited on the inside of chamber in order to reduce particles and extend wet clean cycle. This process step is called cleaning step in film deposition cycle used by PECVD tool. Generally, the fixed amount of PFC suited for its deposited film thickness is used for each cleaning steps and the amount is determined to minimize process time in order to obtain the maximum tool capacity from productivity standing point. However, these cleaning step conditions can not always provide minimum PFC emissions. Below chart shows PFC emissions during cleaning step as a function of various amount of PFC after same thickness deposition of SiO2 using PECVD tool. Condition : pressure 3.0 torr O2/C2F6 flow ratio 0.8 Optim um condition for various requirem ent