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Row Level Kisslap Machine With Direct Feedback

IP.com Disclosure Number: IPCOM000015274D
Original Publication Date: 2002-Sep-08
Included in the Prior Art Database: 2003-Jun-20

Publishing Venue

IBM

Abstract

Disclosed i s a Kiss-Lap machine with a direct feedback method for predicting material removal during lapping. In this implementation, a common membrane or diaphragm with a sticky film, is stretched across the three chamber fixture to form a pressure tight ballast air cushion instead of a sponge. Air supply to each chamber is provided to apply uniform and adjustable lapping force to each chamber where rows will be later mounted. The lapping platform has wear pads, which are used to maintain the correct distance between the membrane and lapping plate. Figure 1. Figure 2